Unleashing Precision: SAPA Technologies – Your Customized PCB Solutions Partner

At SAPA Technologies, we pride ourselves on being at the forefront of cutting-edge technology, combining advanced machines with extensive customization expertise to meet a diverse range of production needs. Specializing in the customization of Surface Mount Technology (SMT) components, we excel in tailoring SMT nozzles, carriers, jigs, and supporters to ensure unparalleled precision for your specific requirements.

Unmatched Capabilities: Our state-of-the-art facilities enable us to customize PCB solutions that go beyond industry standards. If your application exceeds our current capabilities, don’t hesitate to reach out to us. We are committed to tailoring solutions that address your unique challenges. Your intricate requirements inspire us to push boundaries and find innovative solutions, making SAPA Technologies your trusted partner in customized PCB solutions.

Comprehensive Specifications: Our PCB production capabilities boast impressive dimensions, supporting dimensions from x: 50mm to 1200mm, y: 40mm to 480mm, and thickness ranging from 0.1mm to 4.2mm. We offer a variety of finishes including HASL, ENIG, Silver, OSP, and accept all finishes. Our material expertise spans Rigid, Rogers 4000, Flex, Rigid Flex, Metal Clad, and other specialized materials.

Versatile Component Handling: From tiny components ranging from 01005 to 2.83” (0402 to 72mm) to various packaging options such as reels, cut tape, tube, tray, and loose parts, our capabilities cover a wide spectrum. Our SMT placement speed of 40,000CPH ensures optimal efficiency, while our placement accuracy of ±40㎛ (BGA/QFP ±50㎛) guarantees precision in every detail.

Advanced BGA Handling: We specialize in handling Ball Grid Array (BGA) components with precision. Our capabilities include accommodating ball amounts ranging from x: 2 to 50, y: 2 to 50 (2500 balls maximum). We can handle pitch dimensions from x: 0.2mm to 5mm and y: 0.2mm to 5mm. Additionally, we excel in handling Land Grid Array (LGA), Quad Flat No-leads (QFN), and various connectors with minimal lead pitch of 0.2mm.

Your Strategic Partner: Trust us to be your strategic partner in addressing the complexities of customized PCB solutions. We not only meet your unique production needs but exceed them. Your specific challenges are opportunities for us to showcase our commitment to excellence and customer satisfaction. SAPA Technologies – Unleashing Precision, Crafting Excellence in Customized PCB Solutions.